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General Information
    • ISSN: 2301-3559
    • Frequency: Quarterly
    • DOI: 10.18178/LNSE
    • Editor-in-Chief: Prof. Jemal Antidze
    • Executive Editor: Ms. Nina Lee
    • Abstracting/ Indexing: EI (INSPEC, IET), Electronic Journals Library,  Ulrich's Periodicals Directory, International Computer Science Digital Library (ICSDL), ProQuest and Google Scholar.
    • E-mail: lnse@ejournal.net
Editor-in-chief
Prof. Jemal Antidze
I. Vekua Scientific Institute of Applied Mathematics
Tbilisi State University, Georgia
I'm happy to take on the position of editor in chief of LNSE. We encourage authors to submit papers concerning any branch of Software Engineering.

LNSE 2014 Vol.2(1): 48-53 ISSN: 2301-3559
DOI: 10.7763/LNSE.2014.V2.93

The Performance of Rectangular Microstrip Structure by Applying the Cole-Cole Diagram Concept

Settapong Malisuwan, Jesada Sivaraks, and Nattakit Suriyakrai
Abstract—This research provides a method for analyzing the performance of a rectangular microstrip structure by adopting Cole-Cole diagram. A “reactive relaxation” concept is introduced to represent the frequency-dependent characteristics of a microstrip. Included in the algorithm are relevant considerations relevant to the substrate dielectric and strip-line conductor losses. The proposed concept is used to analyze the microstrip structure performance. The proposed models are set up for use in computer-aided microstrip design and are fully compatible with the needs and trends of modern computer-aided microstrip antenna design and RF integrated circuit (RFID) design.

Index Terms—Dielectric substrate, cole-cole diagram, frequency-dependent, microstrip structure.

The authors are with the National Broadcasting and Telecommunications Commission, Bangkok, Thailand (e-mail: settapong.m@nbtc.go.th, jesada.s@nbtc.go.th, nattakit.s@nbtc.go.th).

[PDF]

Cite: Settapong Malisuwan, Jesada Sivaraks, and Nattakit Suriyakrai, "The Performance of Rectangular Microstrip Structure by Applying the Cole-Cole Diagram Concept," Lecture Notes on Software Engineering vol. 2, no. 1, pp. 48-53, 2014.

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